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PCB Fabrication

PCB Capability
Base Material: FR4,Tg130℃-Tg170℃,Aluminim base,copper base.Rogers etc.
Min/Max Number of Layers: 1 to 20 layers
Max Dimension of Board: 864X610mm (24inch*34inch)
Min/Max Final Thickness Board: 0.2-7.0mm
Copper Foil Thickness: 0.5 OZ to 20 OZ
Finished Surface: HASL,LF HASL,Immersion Gold, Immersion Silver, Immersion Tin, Gold Finger, Flash God, OSP
Impedance control +/- 10%
Solder Mask (colors): Green,Red,Yellow,White,Black,Blue,etc
Silkscreen (colors): White,Black
Mini Line Width/Space: 3mil/3mil
G/F Au thickness: 50u” max
Min finished hole size: 6mil/0.15mm
Max Aspect ratio: 12:1
Minimum Annular Ring: 12mil
Via hole type: Buried, blind.Plugged.Via in pad
Outline finish type: CNC routing, Punch, V-score
Min.soldermask opening: 0.05mm (2mil)
Min.soldermask coverage: 0.05mm (2mil)


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